The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 06, 2015

Filed:

May. 13, 2010
Applicants:

King Owyang, Atherton, CA (US);

Mohammed Kasem, Santa Clara, CA (US);

Yuming Bai, Union City, CA (US);

Frank Kuo, Kaoshiung, TW;

Sen Mao, Kaoshiung, TW;

Sam Kuo, Ping-Dong, TW;

Inventors:

King Owyang, Atherton, CA (US);

Mohammed Kasem, Santa Clara, CA (US);

Yuming Bai, Union City, CA (US);

Frank Kuo, Kaoshiung, TW;

Sen Mao, Kaoshiung, TW;

Sam Kuo, Ping-Dong, TW;

Assignee:

Vishay-Siliconix, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 25/16 (2006.01); H01L 23/36 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H05K 1/14 (2006.01); H02M 3/00 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/20 (2006.01); H05K 3/28 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01L 25/16 (2013.01); H01L 23/36 (2013.01); H01L 23/49861 (2013.01); H01L 24/49 (2013.01); H05K 1/141 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/0106 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/30107 (2013.01); H02M 3/00 (2013.01); H05K 1/0206 (2013.01); H05K 1/0218 (2013.01); H05K 1/181 (2013.01); H05K 3/202 (2013.01); H05K 3/284 (2013.01); H05K 3/3436 (2013.01); H05K 2201/10166 (2013.01); H01L 24/48 (2013.01); H01L 2224/32225 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/014 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48137 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/15747 (2013.01);
Abstract

A complete power management system implemented in a single surface mount package. The system may be drawn to a DC to DC converter system and includes, in a leadless surface mount package, a driver/controller, a MOSFET transistor, passive components (e.g., inductor, capacitor, resistor), and optionally a diode. The MOSFET transistor may be replaced with an insulated gate bipolar transistor, IGBT in various embodiments. The system may also be a power management system, a smart power module or a motion control system. The passive components may be connected between the leadframe connections. The active components may be coupled to the leadframe using metal clip bonding techniques. In one embodiment, an exposed metal bottom may act as an effective heat sink.


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