The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2018
Filed:
Mar. 14, 2013
Applicant:
Vishay-siliconix, Santa Clara, CA (US);
Inventors:
Assignee:
Vishay-Siliconix, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/051 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49575 (2013.01); H01L 23/051 (2013.01); H01L 23/4952 (2013.01); H01L 23/49513 (2013.01); H01L 23/49541 (2013.01); H01L 23/49568 (2013.01); H01L 24/34 (2013.01); H01L 24/36 (2013.01); H01L 24/37 (2013.01); H01L 24/40 (2013.01); H01L 24/73 (2013.01); H01L 24/97 (2013.01); H01L 21/561 (2013.01); H01L 2224/371 (2013.01); H01L 2224/3754 (2013.01); H01L 2224/37147 (2013.01); H01L 2224/40095 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/8485 (2013.01); H01L 2224/84801 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01);
Abstract
In one embodiment, a stack die package can include a lead frame and a first die including a gate and a source that are located on a first surface of the first die and a drain that is located on a second surface of the first die that is opposite the first surface. The gate and source are flip chip coupled to the lead frame. The stack die package can include a second die including a gate and a drain that are located on a first surface of the second die and a source that is located on a second surface of the second die that is opposite the first surface. The source of the second die is facing the drain of the first die.