Nagano, Japan

Seiji Sato

This inventor holds 11 USPTO granted patents. Top assignee: Shinko Electric Industries Co., Ltd.. Active years: 2010-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Seiji Sato. Retrieved from https://idiyas.com/inventor/seiji-sato-gekx3sn1

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 90.9

Average Co-Inventor Count = 2.0

ph-index = 4

Forward Citations = 103(Granted Patents)


Company Filing History:


Years Active: 2010-2025

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11 patents (USPTO):Explore Patents

Title: Seiji Sato: Innovator in Semiconductor Technology

Introduction

Seiji Sato is a prominent inventor based in Nagano, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 11 patents. His innovative work has paved the way for advancements in embedded printed circuit boards and semiconductor packaging.

Latest Patents

One of Seiji Sato's latest patents is for an embedded printed circuit board. This invention includes a first substrate, a semiconductor chip mounted on the first substrate, and a second substrate provided on the first substrate via the semiconductor chip. The design ensures that the semiconductor chip is sandwiched between the first and second substrates. Additionally, the patent describes a first resin that fills the space between the semiconductor chip and the first substrate, featuring a cladding portion that covers the side surface of the semiconductor chip. A second resin encapsulates both the semiconductor chip and the first resin, enhancing the overall structure.

Another notable patent is for a semiconductor package. This package consists of a first substrate and a semiconductor chip mounted on it, with the circuit formation surface oriented toward the first substrate. A second substrate is arranged above the first substrate, sandwiching the semiconductor chip in between. The resin used in this package seals the semiconductor chip and fills the space between the two substrates. The second substrate includes a solder resist layer with a protruding portion that enhances the connection to the semiconductor chip.

Career Highlights

Seiji Sato is currently employed at Shinko Electric Industries Co., Ltd., where he continues to innovate in the semiconductor field. His work has been instrumental in developing advanced technologies that improve the efficiency and reliability of electronic devices.

Collaborations

Throughout his career, Seiji has collaborated with notable colleagues, including Takashi Ozawa and Masatoshi Nakamura. These partnerships have fostered a creative environment that encourages the exchange of ideas and technological advancements.

Conclusion

Seiji Sato's contributions to semiconductor technology through his patents and collaborations highlight his role as a leading inventor in the industry. His innovative designs continue to influence the development of electronic components, ensuring a lasting impact on technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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