The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2011
Filed:
Jan. 29, 2008
Takashi Ozawa, Nagano, JP;
Seiji Sato, Nagano, JP;
Masao Nakazawa, Nagano, JP;
Mitsuyoshi Imai, Nagano, JP;
Masatoshi Nakamura, Nagano, JP;
Kei Imafuji, Nagano, JP;
Takashi Ozawa, Nagano, JP;
Seiji Sato, Nagano, JP;
Masao Nakazawa, Nagano, JP;
Mitsuyoshi Imai, Nagano, JP;
Masatoshi Nakamura, Nagano, JP;
Kei Imafuji, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano-shi, JP;
Abstract
A solderis formed, by a plating method, on a connecting surfaceA and a side surfaceB in a connecting padof a wiring boardwhich is opposed to a metal bumpformed on an electrode padof a semiconductor chip, and subsequently, the solderis molten to form an accumulated soldertaking a convex shape on the connecting surfaceA of the connecting padand the metal bumpis then mounted on the connecting surfaceA of the connecting padon which the accumulated solder is formed, and the accumulated solderand the metal bumpare thus bonded to each other.