Company Filing History:
3 out of 1,699 
2 out of 832,843 Years Active: 2002-2018
Title: Mitsuyoshi Imai: Innovator in Wiring Substrate Technology
Introduction
Mitsuyoshi Imai is a notable inventor based in Nagano, Japan. He has made significant contributions to the field of wiring substrate technology, holding a total of 5 patents. His innovative designs have advanced the capabilities of electronic devices.
Latest Patents
Imai's latest patents include a wiring substrate that features a flexible insulation substrate. This substrate incorporates a first wiring layer on its upper surface and a second wiring layer on its lower surface. The design also includes through wiring that connects both layers, featuring a projection that extends along the lower surface of the second wiring layer. Another notable patent involves a wiring substrate that consists of an adhesive layer, a wiring layer, and a support substrate. This design allows for partial exposure of the wiring layer through a hole extending through the adhesive layer and support substrate.
Career Highlights
Throughout his career, Mitsuyoshi Imai has worked with Shinko Electric Industries Co., Ltd. His work has been instrumental in developing advanced wiring substrates that enhance the performance of semiconductor devices.
Collaborations
Imai has collaborated with notable colleagues such as Hideki Toya and Masaki Sakaguchi. Their combined expertise has contributed to the success of various projects in the field of wiring substrates.
Conclusion
Mitsuyoshi Imai's contributions to wiring substrate technology have established him as a key figure in the industry. His innovative patents continue to influence the development of electronic devices.