The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2002
Filed:
Dec. 06, 1999
Hideki Toya, Nagano, JP;
Mitsuyoshi Imai, Nagano, JP;
Masaki Sakaguchi, Nagano, JP;
Naoki Yamabe, Nagano, JP;
Mamoru Suwa, Kawasaki, JP;
Toshiyuki Motooka, Kawasaki, JP;
Hideharu Sakoda, Kawasaki, JP;
Muneharu Morioka, Kawasaki, JP;
Other;
Abstract
In order to improve adhesion between a plated film which functions as an external connection terminal of a semiconductor device and a surface of a resin protuberance and to improve reliability, a carrier substrate includes a metal substrate which is shaped into a sheet form, to which a semiconductor chip is fixed, and which is removed before the semiconductor device is completed, a recess formed at a position of the metal substrate corresponding to the resin protuberance and having a rugged bottom surface and/or a rugged side surface, and a plated film formed on the inner surface of the recess