Company Filing History:
Years Active: 2002-2004
Title: Innovations of Inventor Hideki Toya
Introduction
Hideki Toya is a notable inventor based in Nagano, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on improving the reliability and efficiency of semiconductor devices.
Latest Patents
One of his latest patents is for a resin used in semiconductor wire. This innovation aims to enhance the adhesion between a plated film, which serves as an external connection terminal of a semiconductor device, and the surface of a resin protuberance. The design includes a carrier substrate made of a metal sheet, which supports a semiconductor chip and is removed before the device is finalized. The patent also describes a recess in the metal substrate that corresponds to the resin protuberance, featuring a rugged bottom and/or side surface, along with a plated film on the inner surface of the recess.
Another significant patent by Toya is related to a lead frame and its manufacturing method. This lead frame consists of lead portions extending from a frame portion, resembling the teeth of a comb. Each lead portion has a top end, a center, and a base connected to the frame. The design includes constriction portions that connect the top end to the center and the center to the base, with the thickness of the side surfaces of the center and top end being thinner than the remaining portions.
Career Highlights
Throughout his career, Hideki Toya has worked with various companies, including Shinko Electric Industries Co., Ltd. His expertise in semiconductor technology has allowed him to contribute to advancements in the industry.
Collaborations
Toya has collaborated with notable individuals in his field, including Mitsuyoshi Imai and Masaki Sakaguchi. These collaborations have further enriched his work and innovations.
Conclusion
Hideki Toya's contributions to semiconductor technology through his patents demonstrate his commitment to innovation and improvement in the field. His work continues to influence the development of reliable semiconductor devices.