The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2018
Filed:
Nov. 07, 2017
Applicant:
Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano-ken, JP;
Inventors:
Assignee:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 23/538 (2006.01); H05K 1/18 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/06 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 23/4985 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 24/16 (2013.01); H05K 1/028 (2013.01); H05K 1/118 (2013.01); H05K 1/18 (2013.01); H05K 3/061 (2013.01); H05K 3/4038 (2013.01); H01L 2224/16227 (2013.01);
Abstract
A wiring substrate includes a flexible insulation substrate, a first wiring layer formed on an upper surface of the insulation substrate, a second wiring layer formed on a lower surface of the insulation substrate, and through wiring bonded to the first wiring layer and the second wiring layer and formed in a through hole extending through the first wiring layer, the insulation substrate, and the second wiring layer. The through wiring includes a projection that extends along a lower surface of the second wiring layer located outside the through hole. An upper surface of the through wiring is flush with an upper surface of the first wiring layer.