The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8222749 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 17, 2012

Filed:

Oct. 20, 2008
Applicants:

Seiji Sato, Nagano, JP;

Takashi Ozawa, Nagano, JP;

Inventors:

Seiji Sato, Nagano, JP;

Takashi Ozawa, Nagano, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A wiring substrate of the present invention includes such a structure that a plurality of connection pads and leading wiring portions connected to the plurality of connection pads respectively are arranged to an insulating layer of a surface layer side, and the leading wiring portions are arranged to be bended from the connection pads, and a solder layer to protrude upward is provided on the connection pads respectively. A solder on the leading wiring portions moves to the bend portion side, and thus the solder layer to protrude upward is formed on the connection pads.


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Sato, Seiji. (2012). Wiring substrate and semiconductor device (U.S. Patent No. 8222749). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8222749

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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