The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2014
Filed:
Jun. 04, 2009
Yasushi Araki, Nagano, JP;
Seiji Sato, Nagano, JP;
Masatoshi Nakamura, Nagano, JP;
Takashi Ozawa, Nagano, JP;
Yasushi Araki, Nagano, JP;
Seiji Sato, Nagano, JP;
Masatoshi Nakamura, Nagano, JP;
Takashi Ozawa, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano-Shi, JP;
Abstract
A solder resist and a central pad to which a central Au bump provided on a semiconductor chip is flip-chip bonded are formed on a substrate main body. In a flip-chip mounting substrate where an underfill resin is provided after the semiconductor chip is mounted, a central opening portion for exposing the central pad is formed in the solder resist, and also, an edge portion forming the central opening portion of the solder resist is partially overlapped with the outer peripheral portion of the central pad.