The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 04, 2025

Filed:

Dec. 06, 2022
Applicant:

Shinko Electric Industries Co., Ltd., Nagano, JP;

Inventor:

Seiji Sato, Nagano, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/185 (2013.01); H05K 2201/0212 (2013.01); H05K 2201/10674 (2013.01); H05K 2201/10734 (2013.01); H05K 2201/10977 (2013.01);
Abstract

An embedded printed circuit board includes a first substrate, a semiconductor chip mounted on the first substrate, a second substrate provided on the first substrate via the semiconductor chip so that the semiconductor chip is sandwiched between the first substrate and the second substrate, a first resin filled between the semiconductor chip and the first substrate and having a cladding portion covering a side surface of the semiconductor chip, and a second resin filled between the first substrate and the second substrate and encapsulating the semiconductor chip and the first resin. The first resin includes a protrusion protruding from the cladding portion toward the second substrate.


Find Patent Forward Citations

Quick Actions:

Sato, Seiji. (2025). Embedded printed circuit board (U.S. Patent No. 12245376). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12245376

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…