The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 08, 2011
Filed:
Dec. 17, 2007
Takashi Ozawa, Nagano, JP;
Yasushi Araki, Nagano, JP;
Masatoshi Nakamura, Nagano, JP;
Seiji Sato, Nagano, JP;
Takashi Ozawa, Nagano, JP;
Yasushi Araki, Nagano, JP;
Masatoshi Nakamura, Nagano, JP;
Seiji Sato, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano-shi, JP;
Abstract
It is a flip-chip mounting substrate according to the invention has a wiring pattern in which bonding pads and predetermined parts of lead wires continuously extending from the bonding pads are exposed from an insulating layer or a solder resist. In the flip-chip mounting substrate, exposed parts of the wiring pattern are formed in to a plurality of different shapes. The exposed parts are formed so that the areas of the bonding pads are substantially equal to one another, and that the total areas of predetermined parts of the lead wires continuously extending from the bonding pads are substantially equal to one another.