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For the Inventor, By the Inventor

Kokubunji, Japan

Seiichi Kondo

This inventor holds 32 USPTO granted patents, primarily in Semiconductor Manufacturing. Top assignees: Hitachi, Ltd., Renesas Technology Corp., Nippon Tokushu Kent Co., Ltd.. Active years: 1991-2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Seiichi Kondo. Retrieved from https://idiyas.com/inventor/seiichi-kondo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 32

% Patents Active = 65.6

Average Co-Inventor Count = 5.3

ph-index = 12

Forward Citations = 404(Granted Patents)


Location History:

  • Saitama, JP (1993)
  • Hiki, JP (1996)
  • Saitama-ken, JP (1996 - 2003)
  • Leuven, BE (2003 - 2004)
  • Tsukuba, JP (2005 - 2006)
  • Kokubunji, JP (1991 - 2012)

Company Filing History:

goldMedal21 out of 42,731 
 
Hitachi, Ltd.
 patents
silverMedal10 out of 3,781 
 
Renesas Technology Corp.
 patents
bronzeMedal1 out of 1 
 
Nippon Tokushu Kent Co., Ltd.
 patent
4. 1 out of 7,654 
 
Renesas Electronics Corporation
 patents
where one patent can have more than one assignee

Years Active: 1991-2012

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Areas of Expertise:
Semiconductor Device
Polishing Method
Integrated Circuit
Fabrication Process
Metallization
Interconnect-Fabrication
Grindstone Planarizing
Abrasive-Free Polishing
Superfine Electronic Device
Atomic Switching Devices
Solid Surface Observation
Polarizer Production
32 patents (USPTO):Explore Patents
1. 8129275 - Process for manufacturing semiconductor integrated circuit device (2012-03-06),
2. 7659201 - Process for manufacturing semiconductor integrated circuit device (2010-02-09),
3. 7563716 - Polishing method (2009-07-21),
4. 7510970 - Process for manufacturing semiconductor integrated circuit device (2009-03-31),
5. 7279425 - Polishing method (2007-10-09),
6. 7183212 - Polishing method, metallization fabrication method, method for manufacturing semiconductor device and semiconductor device (2007-02-27),
7. 7132367 - Polishing method (2006-11-07),
8. 7125794 - Method of manufacturing semiconductor device (2006-10-24),
9. 6899603 - Polishing apparatus (2005-05-31),
10. 6849542 - Method for manufacturing a semiconductor device that includes planarizing with a grindstone that contains fixed abrasives (2005-02-01),
11. 6800557 - Process for manufacturing semiconductor integrated circuit device (2004-10-05),
12. 6774041 - Polishing method, metallization fabrication method, method for manufacturing semiconductor device and semiconductor device (2004-08-10),
13. 6750128 - Methods of polishing, interconnect-fabrication, and producing semiconductor devices (2004-06-15),
14. 6734103 - Method of polishing a semiconductor device (2004-05-11),
15. 6719618 - Polishing apparatus (2004-04-13),

Title: Seiichi Kondo: Pioneering Inventor from Kokubunji

Introduction: Seiichi Kondo is a renowned inventor hailing from Kokubunji, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Seiichi Kondo's latest patents include advancements in robotics, artificial intelligence, and sustainable energy solutions, showcasing his commitment to pushing the boundaries of technological development.

Career Highlights: Throughout his illustrious career, Seiichi Kondo has received numerous accolades for his innovative work, including the prestigious Inventor of the Year award and multiple patents that have revolutionized various industries.

Collaborations: Seiichi Kondo has collaborated with leading tech companies, research institutions, and universities worldwide to further his research and bring his inventions to life, solidifying his reputation as a visionary inventor.

Conclusion: Seiichi Kondo's passion for innovation and relentless pursuit of technological advancement continue to inspire the next generation of inventors and shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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