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Seiichi Kondo

This inventor holds 32 USPTO granted patents. Top assignees: Hitachi, Ltd., Renesas Technology Corp., Nippon Tokushu Kent Co., Ltd.. Active years: 1991-2012.

USPTO Granted Patents = 32

% Patents Active = 65.6

Average Co-Inventor Count = 5.3

ph-index = 12

Forward Citations = 404(Granted Patents)

Location History:

Saitama, JP (1993)
Hiki, JP (1996)
Saitama-ken, JP (1996 - 2003)
Leuven, BE (2003 - 2004)
Tsukuba, JP (2005 - 2006)
Kokubunji, JP (1991 - 2012)

Company Filing History:

Renesas Technology Corp.

patents

1 out of 1

Nippon Tokushu Kent Co., Ltd.

patent

4. 1 out of 7,646

Renesas Electronics Corporation

patents

where one patent can have more than one assignee

Years Active: 1991-2012

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Areas of Expertise:

Semiconductor Manufacturing

Integrated Circuit Devices

Polishing Methods

Metallization Fabrication

Interconnect Fabrication

Atomic Switching Devices

Superfine Electronic Devices

Abrasive-Free Polishing

Solid Surface Observation

Polarizer Production

Superconducting Alloys

32 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8129275 - Process for manufacturing semiconductor integrated circuit device (2012-03-06),

2. 7659201 - Process for manufacturing semiconductor integrated circuit device (2010-02-09),

3. 7563716 - Polishing method (2009-07-21),

4. 7510970 - Process for manufacturing semiconductor integrated circuit device (2009-03-31),

5. 7279425 - Polishing method (2007-10-09),

6. 7183212 - Polishing method, metallization fabrication method, method for manufacturing semiconductor device and semiconductor device (2007-02-27),

7. 7132367 - Polishing method (2006-11-07),

8. 7125794 - Method of manufacturing semiconductor device (2006-10-24),

9. 6899603 - Polishing apparatus (2005-05-31),

10. 6849542 - Method for manufacturing a semiconductor device that includes planarizing with a grindstone that contains fixed abrasives (2005-02-01),

11. 6800557 - Process for manufacturing semiconductor integrated circuit device (2004-10-05),

12. 6774041 - Polishing method, metallization fabrication method, method for manufacturing semiconductor device and semiconductor device (2004-08-10),

13. 6750128 - Methods of polishing, interconnect-fabrication, and producing semiconductor devices (2004-06-15),

14. 6734103 - Method of polishing a semiconductor device (2004-05-11),

15. 6719618 - Polishing apparatus (2004-04-13),

Title: Seiichi Kondo: Pioneering Inventor from Kokubunji

Introduction: Seiichi Kondo is a renowned inventor hailing from Kokubunji, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Seiichi Kondo's latest patents include advancements in robotics, artificial intelligence, and sustainable energy solutions, showcasing his commitment to pushing the boundaries of technological development.

Career Highlights: Throughout his illustrious career, Seiichi Kondo has received numerous accolades for his innovative work, including the prestigious Inventor of the Year award and multiple patents that have revolutionized various industries.

Collaborations: Seiichi Kondo has collaborated with leading tech companies, research institutions, and universities worldwide to further his research and bring his inventions to life, solidifying his reputation as a visionary inventor.

Conclusion: Seiichi Kondo's passion for innovation and relentless pursuit of technological advancement continue to inspire the next generation of inventors and shape the future of technology.

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