The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2005
Filed:
Oct. 18, 2002
Soichi Katagiri, Kodaira, JP;
Ui Yamaguchi, Saitama, JP;
Seiichi Kondo, Tsukuba, JP;
Kan Yasui, Kodaira, JP;
Masahiro Kaise, Kuroiso, JP;
Minoru Honda, Osaka, JP;
Soichi Katagiri, Kodaira, JP;
Ui Yamaguchi, Saitama, JP;
Seiichi Kondo, Tsukuba, JP;
Kan Yasui, Kodaira, JP;
Masahiro Kaise, Kuroiso, JP;
Minoru Honda, Osaka, JP;
Hitachi, Ltd., Tokyo, JP;
Nippon Tokushu Kent Co., Ltd., Kyoto, JP;
Abstract
The invention provides a method for manufacturing a semiconductor device with reduced dishing and erosion. In this method for manufacturing a semiconductor device, the convex/concave pattern is planarized by relatively moving a substrate having the convex/concave pattern on the surface and a polishing tool with pressing the convex/concave surface of the substrate on the polishing tool. The polishing tool is provided with a grindstonehaving a plurality of polygonal segments, which comprises abrasivethat is bonded together with resinand contains pores. The polygonal segments are arranged so that corners of three or more polygonal segments are not located near each other.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile