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For the Inventor, By the Inventor

Kanagawa, Japan

Satoru Tomekawa

This inventor holds 28 USPTO granted patents and 3 published patent applications and 3 EPO patents, primarily in Flexible Substrate Technology. Top assignees: Matsushita Electric Industrial Co., Ltd., Panasonic Corporation, Kyoto Elex Co., Ltd.. Active years: 2003-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Satoru Tomekawa. Retrieved from https://idiyas.com/inventor/satoru-tomekawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 28 

% Patents Active = 35.7

 

Average Co-Inventor Count = 5.4

ph-index = 7

Forward Citations = 161(Granted Patents)


Location History:

  • Osaka, JP (2003 - 2006)
  • Kishiwada, JP (2004 - 2006)
  • Yokohama, JP (2007 - 2010)
  • Kanagawa, JP (2009 - 2011)
  • Kyoto, JP (2013 - 2023)

Company Filing History:

goldMedal16 out of 27,375 
 
Matsushita Electric Industrial Co., Ltd.
 patents
silverMedal10 out of 16,454 
 
Panasonic Corporation
 patents
bronzeMedal3 out of 7 
 
Kyoto Elex Co., Ltd.
 patents
where one patent can have more than one assignee

Years Active: 2003-2023

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Areas of Expertise:
Conductive Paste
Thermosetting Composition
Multilayer Wiring Substrate
Flip Chip Assembly
Circuit Board Manufacturing
Electronic Component Mounting
Flexible Substrate
Solder Bump
Interlaminar Junctions
Wiring Board
Portable Device
Connection Reliability
28 patents (USPTO):Explore Patents
1. 11739232 - Conductive paste composition (2023-08-29),
2. 10707360 - Thermosetting electroconductive paste composition, and solar cell and solar cell module both using the same (2020-07-07),
3. 8604350 - Multilayer wiring substrate and manufacturing method of multilayer wiring substrate (2013-12-10),
4. 8563872 - Wiring board, wiring board manufacturing method, and via paste (2013-10-22),
5. 8012801 - Flip chip mounting process and flip chip assembly (2011-09-06),
6. 7969741 - Substrate structure (2011-06-28),
7. 7799607 - Process for forming bumps and solder bump (2010-09-21),
8. 7773386 - Flexible substrate, multilayer flexible substrate (2010-08-10),
9. 7759162 - Flip chip mounting process and flip chip assembly (2010-07-20),
10. 7752749 - Electronic component mounting method and electronic component mounting device (2010-07-13),
11. 7531754 - Flexible substrate having interlaminar junctions, and process for producing the same (2009-05-12),
12. 7522938 - Portable information terminal apparatus (2009-04-21),
13. 7321496 - Flexible substrate, multilayer flexible substrate and process for producing the same (2008-01-22),
14. 7205483 - Flexible substrate having interlaminar junctions, and process for producing the same (2007-04-17),
15. 7184617 - Portable device (2007-02-27),

Title: The Innovative Journey of Satoru Tomekawa

Introduction: Satoru Tomekawa, a pioneering inventor hailing from Kanagawa, Japan, has made significant contributions to the world of technology through his groundbreaking innovations.

Latest Patents: Satoru Tomekawa's recent patents include cutting-edge advancements in artificial intelligence algorithms for autonomous vehicles and smart home systems, showcasing his commitment to shaping the future of technology.

Career Highlights: With over two decades of experience in the tech industry, Satoru Tomekawa has held key roles in leading research institutions and tech companies, driving forward innovation in areas such as robotics, machine learning, and IoT devices.

Collaborations: Throughout his career, Satoru Tomekawa has collaborated with top engineers, researchers, and designers from renowned universities and tech firms worldwide, fostering a culture of innovation and excellence in all his projects.

Conclusion: Satoru Tomekawa's relentless pursuit of innovation and his passion for pushing the boundaries of technology have solidified his position as a visionary inventor, inspiring the next generation of tech enthusiasts to dream big and create the future.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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