The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2011
Filed:
Mar. 04, 2010
Seiji Karashima, Osaka, JP;
Yoshihisa Yamashita, Kyoto, JP;
Satoru Tomekawa, Kanagawa, JP;
Takashi Kitae, Osaka, JP;
Seiichi Nakatani, Osaka, JP;
Seiji Karashima, Osaka, JP;
Yoshihisa Yamashita, Kyoto, JP;
Satoru Tomekawa, Kanagawa, JP;
Takashi Kitae, Osaka, JP;
Seiichi Nakatani, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A flip chip mounting process includes the steps of supplying a resin () containing solder powder and a convection additive () onto a wiring substrate () having a plurality of electrode terminals (II), then bringing a semiconductor chip () having a plurality of connecting terminals () into contact with a surface of the supplied resin (), and then heating the wiring substrate () to a temperature that enables the solder powder to melt. The heating step is carried out at a temperature that is higher than the boiling point of the convection additive () to allow the boiling convection additive () to move within the resin (). During this heating step, the melted solder powder is allowed to self-assemble into the region between each electrode terminal () of the wiring substrate () and each connecting terminal () of the semiconductor chip to form an electrical connection between each electrode terminal () and each connecting terminal ().