The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2013
Filed:
Feb. 22, 2011
Shogo Hirai, Osaka, JP;
Hiroyuki Ishitomi, Osaka, JP;
Tsuyoshi Himori, Osaka, JP;
Satoru Tomekawa, Kyoto, JP;
Yutaka Nakayama, Kyoto, JP;
Shogo Hirai, Osaka, JP;
Hiroyuki Ishitomi, Osaka, JP;
Tsuyoshi Himori, Osaka, JP;
Satoru Tomekawa, Kyoto, JP;
Yutaka Nakayama, Kyoto, JP;
Panasonic Corporation, Osaka, JP;
Kyoto Elex Co., Ltd., Kyoto, JP;
Abstract
A wiring board includes a plurality of wirings laid via an insulating resin layer, and a via-hole conductor provided for electrically connecting the wirings. The via-hole conductor includes metal and resin portions. The metal portion includes a region made of copper particles, a first metal region mainly composed of tin, a tin-copper alloy, or a tin-copper intermetallic compound, and a second metal region mainly composed of bismuth, and has Cu/Sn of from 1.59 to 21.43. The copper particles are in contact with one another, thereby electrically connecting the wirings, and at least part of the first metal region covers around and extends over the portions where the copper particles are in plane contact with one another.