The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 21, 2010
Filed:
Aug. 30, 2005
Seiji Karashima, Osaka, JP;
Yoshihisa Yamashita, Kyoto, JP;
Satoru Tomekawa, Kanagawa, JP;
Takashi Kitae, Osaka, JP;
Seiichi Nakatani, Osaka, JP;
Seiji Karashima, Osaka, JP;
Yoshihisa Yamashita, Kyoto, JP;
Satoru Tomekawa, Kanagawa, JP;
Takashi Kitae, Osaka, JP;
Seiichi Nakatani, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A process for forming bumps wherein a plurality of fine bumps are uniformly formed with high productivity. In this process, a resin () including solder powder and a convection additive () is supplied onto a substrate () having a plurality of electrodes () thereon. And subsequently the substrate () is heated to a temperature that enables the solder powder to melt while keeping a flat plate () in contact with a surface of the supplied resin (). During this heating step, the molten solder powder is allowed to self-assemble onto the electrodes () so that a plurality of solder balls, resulting from the grown molten solder powder, are concurrently formed on the electrodes () in self-alignment manner. Finally, the flat plate () is moved away from the surface of the supplied resin (), and then the resin () is removed to provide a substrate () having bumps () formed on the plurality of the electrodes.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile