Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Kyoto Elex Co., Ltd.

Satoru Tomekawa

Takeshi Suzuki

Fumio Echigo

Yoshihisa Yamashita

Seiichi Nakatani

Seiji Karashima

Yoshihiro Kawakita

Yasushi Nakagiri

Tatsuo Ogawa

Takashi Ichiryu

Toshio Fujii

Hiroki Yabe

Daizo Andoh

Yoshihiro Bessho

Takashi Kitae

Toshihiro Nishii

Tsuguhiro Korenaga

Yoshihiro Tomita

Tetsuyoshi Ogura

Kunio Hibino

Yasuhiro Nakatani

Tsuyoshi Himori

Yoji Ueda

Susumu Matsuoka

Yutaka Nakayama

Shogo Hirai

Hiroyuki Ishitomi

Toyoharu Matsubara

Takamitsu Arai

Yuta Motohisa

Kimika Gotou

Shinobu Kokufu

Tadashi Nakamura

Seiji Yamaguchi

Masahiro Ono

Yukihiro Ishimaru

Tousaku Nishiyama

Nobuki Itoh

Kosuke Kubota

Tsukasa Shiraishi

Takeo Matsuki

Mikihiro Shimada

Kazuhiro Konishi

Shinobu Masuda

Kiyoshi Nakanishi

Haruo Hayakawa

Eiji Nishimura

Atsushi Katagiri

Yoshihiro Uda

Kazuhiro Shinchi

Motohisa Kotani

Hiroyoshi Tagi

A conductive paste composition includes a conductive powder (A) and a resin component (B). A silver-based powder containing at least silver is used as the conductive powder (A), at least one of a thermosetting resin and a thermoplastic resin is used as the resin component (B). The conductive paste composition further contains a specific ester-based compound (C) having a molecular weight within a range of 150 to 2000 or a specific ether/amine-based compound (D) having a molecular weight within the range of from 150 to 30,000.

Conductive paste composition

A thermosetting electroconductive paste composition includes an electroconductive powder (A) containing at least one of a silver-coated metal powder (A-1) and a powder of either copper or an alloy thereof (A-2), a thermosetting ingredient (B) containing at least one of an epoxy resin (B-1) and a blocked polyisocyanate compound (B-2), a hardener (C), and an alkyl- or alkenylsuccinic acid compound (D) which is a succinic acid or derivative thereof having an alkyl or alkenyl group having a carbon number of from 8 to 24 introduced into an &#x3b1;-position. An amount of the alkyl- or alkenylsuccinic acid compound is 0.01 to 1.8 parts by mass per 100 parts by mass of a sum of the electroconductive powder (A) and the thermosetting ingredient (B).

Thermosetting electroconductive paste composition, and solar cell and solar cell module both using the same

A multilayer wiring board includes an insulating resin layer, wirings laid on their respective opposite surfaces of the insulating resin layer, and a via-hole conductor for electrically connecting the wirings. The via-hole conductor includes metal and resin portions. The metal portion includes first metal regions including a joined unit made of copper particles for connecting the wirings, second metal regions mainly composed of, for example, tin, a tin-copper alloy, or a tin-copper intermetallic compound, and third metal regions mainly composed of bismuth and in contact with the second metal regions. The copper particles forming the joined unit are in plane contact with one another to form plane contact portions, and the second metal regions at least partially are in contact with the first metal regions.

Multilayer wiring substrate and manufacturing method of multilayer wiring substrate

A wiring board includes a plurality of wirings laid via an insulating resin layer, and a via-hole conductor provided for electrically connecting the wirings. The via-hole conductor includes metal and resin portions. The metal portion includes a region made of copper particles, a first metal region mainly composed of tin, a tin-copper alloy, or a tin-copper intermetallic compound, and a second metal region mainly composed of bismuth, and has Cu/Sn of from 1.59 to 21.43. The copper particles are in contact with one another, thereby electrically connecting the wirings, and at least part of the first metal region covers around and extends over the portions where the copper particles are in plane contact with one another.

Wiring board, wiring board manufacturing method, and via paste

A flip chip mounting process includes the steps of supplying a resin () containing solder powder and a convection additive () onto a wiring substrate () having a plurality of electrode terminals (II), then bringing a semiconductor chip () having a plurality of connecting terminals () into contact with a surface of the supplied resin (), and then heating the wiring substrate () to a temperature that enables the solder powder to melt. The heating step is carried out at a temperature that is higher than the boiling point of the convection additive () to allow the boiling convection additive () to move within the resin (). During this heating step, the melted solder powder is allowed to self-assemble into the region between each electrode terminal () of the wiring substrate () and each connecting terminal () of the semiconductor chip to form an electrical connection between each electrode terminal () and each connecting terminal ().

Flip chip mounting process and flip chip assembly

It is intended to provide a substrate structure ensuring a shielding property and a heat discharge property of a resin part that collectively covers a plurality of electronic components and capable of downsizing, thinning, and a reduction in number of components. The substrate structureof the first embodiment is provided with a substrate, a plurality of electronic componentsmounted along the substrate, and a resin partthat covers the electronic componentsand is in close contact with the substrate. In the substrate structure, the resin partis provided with a reinforcing heat discharge layercovering the electronic componentsand having a heat conductivity and a reinforcing property and a shield layercovering the reinforcing heat discharge layer, and a surface oof the shield layeris formed into a predetermined shape corresponding to a surface structure of the display deviceadjacent to the resin part

Substrate structure

A process for forming bumps wherein a plurality of fine bumps are uniformly formed with high productivity. In this process, a resin () including solder powder and a convection additive () is supplied onto a substrate () having a plurality of electrodes () thereon. And subsequently the substrate () is heated to a temperature that enables the solder powder to melt while keeping a flat plate () in contact with a surface of the supplied resin (). During this heating step, the molten solder powder is allowed to self-assemble onto the electrodes () so that a plurality of solder balls, resulting from the grown molten solder powder, are concurrently formed on the electrodes () in self-alignment manner. Finally, the flat plate () is moved away from the surface of the supplied resin (), and then the resin () is removed to provide a substrate () having bumps () formed on the plurality of the electrodes.

Process for forming bumps and solder bump

A flexible substrate includes: (i) a film; (ii) an insulating resin layer formed on each of a front face of the film and a rear face of the film, which rear face is opposite to the front face; (iii) a front-sided wiring pattern embedded in the insulating resin layer formed on the front face of the film, and a rear-sided wiring pattern embedded in the insulating resin layer formed on the rear face of the film; and (iv) a via which is located between the front-sided wiring pattern and the rear-sided wiring pattern and serves to electrically interconnect the front-sided wiring pattern and the rear-sided wiring pattern, wherein the insulating resin layer formed on each of the front face and the rear face of the film is thicker than the film.

Flexible substrate, multilayer flexible substrate

A flip chip mounting process includes the steps of supplying a resin () containing solder powder and a convection additive () onto a wiring substrate () having a plurality of electrode terminals (), then bringing a semiconductor chip () having a plurality of connecting terminals () into contact with a surface of the supplied resin (), and then heating the wiring substrate () to a temperature that enables the solder powder to melt. The heating step is carried out at a temperature that is higher than the boiling point of the convection additive () to allow the boiling convection additive () to move within the resin (). During this heating step, the melted solder powder is allowed to self-assemble into the region between each electrode terminal () of the wiring substrate () and each connecting terminal () of the semiconductor chip to form an electrical connection between each electrode terminal () and each connecting terminal (). Finally, the resin is cured so as to secure the semiconductor chip () to the wiring substrate ().

One of an electrode terminal of an electronic component and a connecting terminal of a wiring substrate is provided with solder beforehand, one of the wiring substrate and the electronic component is secured, and the electrode terminal and the connecting terminal are made to abut each other so that one of the wiring substrate and the electronic component, whichever is not secured, is held. The electronic component is heated so that the solder melts, and the solder is solidified while the electronic component is held, so that the electrode terminal and the connecting terminal are bonded to each other by the solder. Further, while an interval formed between the wiring substrate and the electronic component by the melted solder is being held, the electrode terminal and the connecting terminal are finely moved relative to each other with reference to a surface of the wiring substrate in an XY&#x3b8; direction.

Electronic component mounting method and electronic component mounting device

A flexible substrate comprises a film, a first insulating resin layer on a front face of the film, a second insulating resin layer on a rear face of the film, a front-sided wiring pattern embedded in the first insulating resin layer, and a rear-sided wiring pattern embedded in the second insulating resin layer. A surface of the front-sided wiring pattern is flush with a surface of the first insulating resin layer, and a surface of the rear-sided wiring pattern is flush with a surface of the second insulating resin layer. A part of at least one of the front-sided wiring pattern and the rear-sided wiring pattern is dented toward a part of the other of the at least one of the front-sided wiring pattern and the rear-sided wiring pattern such that a portion of the front-sided wiring pattern and a portion of the rear-sided wiring pattern are jointed to each other to form a junction.

Flexible substrate having interlaminar junctions, and process for producing the same

Based on information indicating the signal transmission amount between the first and second circuit blocks, a switching device switches an optical signal communication form which uses a first and second optical signal transmitting/receiving devices and an electric signal communication form which uses a first and second electric signal transmitting/receiving devices. Thereby, in a portable information terminal apparatus with a separate main body operation unit and a separate screen display unit, power consumed by the optical signal communication can be suppressed.

Portable information terminal apparatus

A flexible substrate comprises: a film; an insulating resin layer formed on each of a front face of the film and a rear face of the film, which rear face is opposite to the front face; a front-sided wiring pattern embedded in the insulating resin layer formed on the front face of the film, and a rear-sided wiring pattern embedded in the insulating resin layer formed on the rear face of the film; and a via which is located between the front-sided wiring pattern and the rear-sided wiring pattern and serves to electrically interconnect the front-sided wiring pattern and the rear-sided wiring pattern, wherein the insulating resin layer formed on each of the front face and the rear face of the film is thicker than the film.

Flexible substrate, multilayer flexible substrate and process for producing the same

A portable device has a configuration such that a plurality of housings are connected functionally, wherein the thickness of a connection section between the housings is reduced so that the portability is improved. The portable device includes a first housing; a first board provided in the first housing; a second housing; a second board provided in the second housing; a connection section for connecting the first housing with the second housing in such a manner that their relative position can be changed; and an optical waveguide film having at least one optical waveguide for connecting the first board with the second board through optical wiring.

Portable device

Growing community of inventors

Kanagawa, Japan

Satoru Tomekawa