The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2011
Filed:
Feb. 20, 2006
Haruo Hayakawa, Kanagawa, JP;
Masahiro Ono, Kanagawa, JP;
Seiji Yamaguchi, Tokyo, JP;
Yoshihiro Uda, Kanagawa, JP;
Kazuhiro Shinchi, Kanagawa, JP;
Satoru Tomekawa, Kanagawa, JP;
Kiyoshi Nakanishi, Kanagawa, JP;
Kosuke Kubota, Kanagawa, JP;
Atsushi Katagiri, Kanagawa, JP;
Motohisa Kotani, Kanagawa, JP;
Kazuhiro Konishi, Kanagawa, JP;
Eiji Nishimura, Kanagawa, JP;
Takeo Matsuki, Kanagawa, JP;
Haruo Hayakawa, Kanagawa, JP;
Masahiro Ono, Kanagawa, JP;
Seiji Yamaguchi, Tokyo, JP;
Yoshihiro Uda, Kanagawa, JP;
Kazuhiro Shinchi, Kanagawa, JP;
Satoru Tomekawa, Kanagawa, JP;
Kiyoshi Nakanishi, Kanagawa, JP;
Kosuke Kubota, Kanagawa, JP;
Atsushi Katagiri, Kanagawa, JP;
Motohisa Kotani, Kanagawa, JP;
Kazuhiro Konishi, Kanagawa, JP;
Eiji Nishimura, Kanagawa, JP;
Takeo Matsuki, Kanagawa, JP;
Panasonic Corporation, Osaka, JP;
Abstract
It is intended to provide a substrate structure ensuring a shielding property and a heat discharge property of a resin part that collectively covers a plurality of electronic components and capable of downsizing, thinning, and a reduction in number of components. The substrate structureof the first embodiment is provided with a substrate, a plurality of electronic componentsmounted along the substrate, and a resin partthat covers the electronic componentsand is in close contact with the substrate. In the substrate structure, the resin partis provided with a reinforcing heat discharge layercovering the electronic componentsand having a heat conductivity and a reinforcing property and a shield layercovering the reinforcing heat discharge layer, and a surface oof the shield layeris formed into a predetermined shape corresponding to a surface structure of the display deviceadjacent to the resin part