The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 17, 2007
Filed:
Mar. 15, 2005
Yoshihisa Yamashita, Kyoto-fu, JP;
Hiroki Yabe, Moriguchi, JP;
Takashi Ichiryu, Moriguchi, JP;
Seiichi Nakatani, Hirakata, JP;
Satoru Tomekawa, Yokohama, JP;
Toshio Fujii, Neyagawa, JP;
Seiji Karashima, Hirakata, JP;
Yoshihisa Yamashita, Kyoto-fu, JP;
Hiroki Yabe, Moriguchi, JP;
Takashi Ichiryu, Moriguchi, JP;
Seiichi Nakatani, Hirakata, JP;
Satoru Tomekawa, Yokohama, JP;
Toshio Fujii, Neyagawa, JP;
Seiji Karashima, Hirakata, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A flexible substrate comprises a film, a first insulating resin layer on a front face of the film, a second insulating resin layer on a rear face of the film, a front-sided wiring pattern embedded in the first insulating resin layer, and a rear-sided wiring pattern embedded in the second insulating resin layer. A surface of the front-sided wiring pattern is flush with a surface of the first insulating resin layer, and a surface of the rear-sided wiring pattern is flush with a surface of the second insulating resin layer. A part of at least one of the front-sided wiring pattern and the rear-sided wiring pattern is dented toward a part of the other of the at least one of the front-sided wiring pattern and the rear-sided wiring pattern such that a portion of the front-sided wiring pattern and a portion of the rear-sided wiring pattern are jointed to each other to form a junction.