The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 2010
Filed:
Oct. 29, 2007
Yoshihisa Yamashita, Kyoto, JP;
Toshio Fujii, Neyagawa, JP;
Seiichi Nakatani, Hirakata, JP;
Takashi Ichiryu, Moriguchi, JP;
Satoru Tomekawa, Yokohama, JP;
Hiroki Yabe, Moriguchi, JP;
Yoshihisa Yamashita, Kyoto, JP;
Toshio Fujii, Neyagawa, JP;
Seiichi Nakatani, Hirakata, JP;
Takashi Ichiryu, Moriguchi, JP;
Satoru Tomekawa, Yokohama, JP;
Hiroki Yabe, Moriguchi, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A flexible substrate includes: (i) a film; (ii) an insulating resin layer formed on each of a front face of the film and a rear face of the film, which rear face is opposite to the front face; (iii) a front-sided wiring pattern embedded in the insulating resin layer formed on the front face of the film, and a rear-sided wiring pattern embedded in the insulating resin layer formed on the rear face of the film; and (iv) a via which is located between the front-sided wiring pattern and the rear-sided wiring pattern and serves to electrically interconnect the front-sided wiring pattern and the rear-sided wiring pattern, wherein the insulating resin layer formed on each of the front face and the rear face of the film is thicker than the film.