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For the Inventor, By the Inventor

Milpitas, CA, United States of America

Sally Foong

This inventor holds 11 USPTO granted patents. Top assignees: Spansion LLC., Cypress Semiconductor Corporation, Advanced Micro Devices Corporation. Active years: 2002-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sally Foong. Retrieved from https://idiyas.com/inventor/sally-foong

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 11

% Patents Active = 90.9

Average Co-Inventor Count = 4.6

ph-index = 2

Forward Citations = 11(Granted Patents)


Company Filing History:

goldMedal8 out of 1,075 
 
Spansion LLC.
 patents
silverMedal2 out of 3,596 
 
Cypress Semiconductor Corporation
 patents
bronzeMedal1 out of 13,168 
 
Advanced Micro Devices Corporation
 patents

Years Active: 2002-2017

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11 patents (USPTO):Explore Patents
1. 9679831 - Tape chip on lead using paste die attach material (2017-06-13),
2. 9196608 - Method of chip positioning for multi-chip packaging (2015-11-24),
3. 8901756 - Chip positioning in multi-chip package (2014-12-02),
4. 8680686 - Method and system for thin multi chip stack package with film on wire and copper wire (2014-03-25),
5. 8357563 - Stitch bump stacking design for overall package size reduction for multiple stack (2013-01-22),
6. 7932131 - Reduction of package height in a stacked die configuration (2011-04-26),
7. 7799612 - Process applying die attach film to singulated die (2010-09-21),
8. 7750481 - Die offset die to die bonding (2010-07-06),
9. 7674653 - Die offset die to bonding (2010-03-09),
10. 7554204 - Die offset die to die bonding (2009-06-30),
11. 6344161 - Device encapsulation process utilizing pre-cut slots in flexible film substrate (2002-02-05),

Title: The Innovative Journey of Sally Foong

Introduction

Sally Foong is a prominent inventor based in Milpitas, CA (US). She has made significant contributions to the field of semiconductor packaging, holding a total of 11 patents. Her work has paved the way for advancements in technology and has had a lasting impact on the industry.

Latest Patents

Sally's latest patents include innovative methods and systems for packaging semiconductor devices. One of her notable inventions is the "Tape chip on lead using paste die attach material." This patent discusses a semiconductor die that is attached to a lead frame using an adhesive paste, ensuring a secure connection. Another significant patent is the "Method of chip positioning for multi-chip packaging," which outlines a method for accurately positioning integrated circuits on a substrate package using reference markers. These inventions demonstrate her expertise and commitment to enhancing semiconductor technology.

Career Highlights

Throughout her career, Sally has worked with leading companies in the semiconductor industry, including Spansion LLC and Cypress Semiconductor Corporation. Her experience in these organizations has allowed her to develop and refine her innovative ideas, contributing to her success as an inventor.

Collaborations

Sally has collaborated with talented individuals in her field, including Lai Nguk Chin and Kevin Guan. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Sally Foong's contributions to the semiconductor industry through her patents and collaborations highlight her role as a leading inventor. Her innovative spirit continues to inspire advancements in technology and showcases the importance of creativity in engineering.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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