The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2014
Filed:
Dec. 21, 2012
Spansion Llc, Sunnyvale, CA (US);
Sally Foong, Milpitas, CA (US);
Seshasayee Gaddamraja, Santa Clara, CA (US);
Teoh Lai Beng, Penang, MY;
Lai Nguk Chin, Penang, MY;
Suthakavatin Aungkul, Patumtanee, TH;
Spansion LLC, Sunnyvale, CA (US);
Abstract
Embodiments of the present invention include a substrate package, a method for multi-chip packaging, and a multi-chip package. For example, the substrate package includes a first set of reference markers and a second set of reference markers. The first set of reference markers is disposed on the substrate package, where the first set of reference markers is configured to provide a first alignment for positioning a first integrated circuit (IC) and a second alignment for positioning a second IC on the substrate package. Further, the second set of reference markers is disposed at a different location on the substrate package than the first set of reference markers, where the second set of reference markers is configured to provide confirmation of the first alignment and the second alignment.