Teoh Lai Beng

Title: Teoh Lai Beng: Innovator in Multi-Chip Packaging Technology

Introduction

Teoh Lai Beng is a notable inventor based in Penang, Malaysia. He has made significant contributions to the field of multi-chip packaging technology. With a total of 2 patents to his name, his work has advanced the efficiency and effectiveness of integrated circuit (IC) positioning.

Latest Patents

Teoh's latest patents include a method of chip positioning for multi-chip packaging. This invention outlines a method for positioning a first integrated circuit on a substrate package using a set of reference markers. It also details how to confirm the alignment of the first IC and stack a second IC based on these markers. Another patent focuses on the substrate package itself, which includes multiple sets of reference markers to ensure accurate alignment for both the first and second ICs.

Career Highlights

Throughout his career, Teoh has worked with prominent companies such as Spansion LLC and Cypress Semiconductor Corporation. His experience in these organizations has allowed him to refine his skills and contribute to innovative solutions in the semiconductor industry.

Collaborations

Teoh has collaborated with talented individuals in his field, including Seshasayee Gaddamraja and Sally Foong. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Teoh Lai Beng's contributions to multi-chip packaging technology demonstrate his innovative spirit and dedication to advancing the semiconductor industry. His patents reflect a commitment to improving the efficiency of integrated circuit positioning, making a lasting impact in the field.