Cypress Semiconductor Corporation

Spansion Llc.

Teoh Lai Beng

Sally Foong

Lai Nguk Chin

Seshasayee Gaddamraja

Suthakavatin Aungkul

Embodiments of the present invention include a method for multi-chip packaging. For example, the method includes positioning a first integrated circuit (IC) on a substrate package based on a first set of reference markers in physical contact with the substrate package and confirming an alignment of the first IC based on a second set of reference markers in physical contact with the substrate package. A second IC is stacked onto first IC based on the first set of reference markers. An alignment of the second IC is confirmed based on the second set of reference markers, where the second set of reference markers is disposed at a different location on the substrate package than the first set of reference markers.

Method of chip positioning for multi-chip packaging

Embodiments of the present invention include a substrate package, a method for multi-chip packaging, and a multi-chip package. For example, the substrate package includes a first set of reference markers and a second set of reference markers. The first set of reference markers is disposed on the substrate package, where the first set of reference markers is configured to provide a first alignment for positioning a first integrated circuit (IC) and a second alignment for positioning a second IC on the substrate package. Further, the second set of reference markers is disposed at a different location on the substrate package than the first set of reference markers, where the second set of reference markers is configured to provide confirmation of the first alignment and the second alignment.

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Penang, Malaysia

Teoh Lai Beng