The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 2010
Filed:
Dec. 09, 2008
Nguk Chin Lai, Penang, MY;
Kevin Guan, Richmond, CA (US);
Kwet Nam Wong, Penang, MY;
Cheng Sim Kee, Penang, MY;
Sally Foong, Milpitas, CA (US);
Nguk Chin Lai, Penang, MY;
Kevin Guan, Richmond, CA (US);
Kwet Nam Wong, Penang, MY;
Cheng Sim Kee, Penang, MY;
Sally Foong, Milpitas, CA (US);
Spansion LLC, Sunnyvale, CA (US);
Abstract
A semiconductor die is provided on a spacer, the die having first and second opposite edges which extend beyond respective first and second opposite edges of the spacer, the first edge of the die extending beyond the first edge of the spacer to a lesser extent than the second edge of the die extends beyond the second edge of the spacer. Furthermore, a first semiconductor die has a plurality of bond pads thereon, a second semiconductor die has a plurality of bond pads thereon, and a substrate has a plurality of bond pads thereon. Each of a first plurality of wires connects a bond pad on the first semiconductor die with a bond pad on the second semiconductor die, and each of a second plurality of wires connects a bond pad on the second semiconductor die with a bond pad on the substrate.