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For the Inventor, By the Inventor

Penang, Malaysia

Kwet Nam Wong

This inventor holds 5 USPTO granted patents. Top assignee: Spansion LLC.. Active years: 2009-2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kwet Nam Wong. Retrieved from https://idiyas.com/inventor/kwet-nam-wong

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 5

% Patents Active = 60.0

Average Co-Inventor Count = 4.5

ph-index = 1

Forward Citations = 3(Granted Patents)


Location History:

  • Sungai Nibong, MY (2010)
  • Penang, MY (2009 - 2013)

Company Filing History:

goldMedal5 out of 1,075 
 
Spansion LLC.
 patents

Years Active: 2009-2013

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5 patents (USPTO):Explore Patents
1. 8546936 - Method and structure of minimizing mold bleeding on a substrate surface of a semiconductor package (2013-10-01),
2. 7759171 - Method and structure of minimizing mold bleeding on a substrate surface of a semiconductor package (2010-07-20),
3. 7750481 - Die offset die to die bonding (2010-07-06),
4. 7674653 - Die offset die to bonding (2010-03-09),
5. 7554204 - Die offset die to die bonding (2009-06-30),

Title: Kwet Nam Wong: Innovator in Semiconductor Packaging

Introduction

Kwet Nam Wong is a notable inventor based in Penang, Malaysia. He has made significant contributions to the field of semiconductor packaging, holding a total of 5 patents. His innovative approaches have led to advancements in minimizing mold bleeding in semiconductor packages.

Latest Patents

Wong's latest patents focus on methods and structures designed to minimize mold bleeding on the substrate surface of semiconductor packages. One of his patents describes a substrate surface that includes a plurality of product forming areas, which provide mounting spaces for semiconductor chips. Surrounding these areas are staggered offset mesh block areas that effectively minimize mold bleeding from the mold cavity to the outer areas of the substrate surface. Another patent outlines a method that involves forming a dam structure on the outer area of the substrate surface, which blocks the flow of mold material from the mold cavity, ensuring a cleaner and more efficient manufacturing process.

Career Highlights

Kwet Nam Wong has established himself as a key figure in the semiconductor industry through his work at Spansion LLC. His expertise in semiconductor packaging has been instrumental in developing innovative solutions that enhance product reliability and performance.

Collaborations

Wong has collaborated with talented coworkers such as Nguk Chin Lai and Kevin Guan. Their combined efforts have contributed to the successful development of advanced semiconductor packaging technologies.

Conclusion

Kwet Nam Wong's contributions to semiconductor packaging through his innovative patents and collaborative efforts highlight his importance in the field. His work continues to influence the industry and pave the way for future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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