The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 2010
Filed:
Aug. 28, 2007
Pakhorudin Hussin, Kulim, MY;
Murugasan Manikam Achari, Gelugor, MY;
Tee-eu Jin, Bayan Lepas, MY;
Kwet Nam Wong, Sungai Nibong, MY;
Pakhorudin Hussin, Kulim, MY;
Murugasan Manikam Achari, Gelugor, MY;
Tee-Eu Jin, Bayan Lepas, MY;
Kwet Nam Wong, Sungai Nibong, MY;
Spansion LLC, Sunnyvale, CA (US);
Abstract
A method and structure of minimizing mold bleeding on a substrate surface of a semiconductor package is disclosed. In one embodiment, a method includes forming a dam structure on an outer area of a substrate surface of a semiconductor package and blocking a flow of a mold material from a mold cavity of the semiconductor package to the outer area of the substrate surface using the dam structure. In another embodiment, a substrate surface of a semiconductor package includes product forming areas to provide mounting spaces of semiconductor chips and staggered offset mesh block areas surrounding the product forming areas to act as dam structures to minimize mold bleeding from a mold cavity of the semiconductor package to outer areas of the substrate surface.