Murugasan Manikam Achari

This inventor holds 4 USPTO granted patents. Top assignee: Spansion LLC.. Active years: 2008-2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Murugasan Manikam Achari. Retrieved from https://idiyas.com/inventor/murugasan-manikam-achari

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 4

% Patents Active = 50.0

Average Co-Inventor Count = 5.1

ph-index = 1

Forward Citations = 2(Granted Patents)

Location History:

Georgtown, MY (2008 - 2010)
Gelugor, MY (2010)
Penang, MY (2013)

Company Filing History:

4 out of 1,075

Spansion LLC.

patents

Years Active: 2008-2013

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4 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8546936 - Method and structure of minimizing mold bleeding on a substrate surface of a semiconductor package (2013-10-01),

2. 7846771 - Carrier for stacked type semiconductor device and method of fabricating stacked type semiconductor devices (2010-12-07),

3. 7759171 - Method and structure of minimizing mold bleeding on a substrate surface of a semiconductor package (2010-07-20),

4. 7414305 - Carrier for stacked type semiconductor device and method of fabricating stacked type semiconductor devices (2008-08-19),

Title: Murugasan Manikam Achari: Innovator in Semiconductor Technology

Introduction

Murugasan Manikam Achari is a notable inventor based in Georgetown, Malaysia. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His innovative work focuses on improving the efficiency and effectiveness of semiconductor devices.

Latest Patents

Achari's latest patents include a method and structure for minimizing mold bleeding on a substrate surface of a semiconductor package. This invention features a substrate surface that comprises a plurality of product forming areas for mounting semiconductor chips. Additionally, it includes staggered offset mesh block areas that help minimize mold bleeding from the mold cavity to the outer areas of the substrate surface.

Another significant patent is for a carrier designed for stacked-type semiconductor devices. This carrier includes an accommodating section for stacked semiconductor devices, guide portions for proper alignment, and grooves that facilitate the flow of gas or liquid. These features enhance the production yield and cleaning effects during the manufacturing process.

Career Highlights

Murugasan Manikam Achari is currently employed at Spansion LLC, where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor devices, making them more efficient and reliable.

Collaborations

Achari has collaborated with notable coworkers such as Pakhorudin Hussin and Tee-Eu Jin. Their combined expertise has contributed to the successful development of various semiconductor technologies.

Conclusion

Murugasan Manikam Achari is a prominent figure in the semiconductor industry, recognized for his innovative patents and contributions. His work continues to influence the field, paving the way for advancements in semiconductor technology.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]