Spansion Llc.

Murugasan Manikam Achari

Junichi Kasai

Masanori Onodera

Kouichi Meguro

Junji Tanaka

Koji Taya

Yasuhiro Shinma

Kwet Nam Wong

Pakhorudin Hussin

Tee-Eu Jin

A substrate surface of a semiconductor package, comprising: a plurality of product forming areas to provide mounting spaces of semiconductor chips. The substrate surface also comprises a plurality of staggered offset mesh block areas surrounding the plurality of product forming areas. The plurality of staggered offset mesh block areas minimize mold bleeding from a mold cavity of the semiconductor package to outer areas of the substrate surface.

Method and structure of minimizing mold bleeding on a substrate surface of a semiconductor package

A carrier for a stacked-type semiconductor device includes an accommodating section for accommodating stacked semiconductor devices, guide portions guiding the stacked semiconductor devices, and grooves through which a fluid may flow to the accommodating section and to sides of the stacked semiconductor devices. These grooves facilitate the flow of gas or liquid on the sides of the accommodating sections, and it is thus expected that the flow of hot wind during the reflow process and cleaning liquid during the cleaning process can be facilitated. This improves the production yield and the cleaning effects. Holes for connecting the accommodating section to the outside may be provided at corners of the accommodating section. Gas may be guided from the lower side of the accommodating section, so that heat can be efficiently applied to the semiconductor devices and bonding failures therebetween can be reduced. Further, grooves connecting adjacent holes may be provided for accommodating sections adjacent to each other.

Carrier for stacked type semiconductor device and method of fabricating stacked type semiconductor devices

A method and structure of minimizing mold bleeding on a substrate surface of a semiconductor package is disclosed. In one embodiment, a method includes forming a dam structure on an outer area of a substrate surface of a semiconductor package and blocking a flow of a mold material from a mold cavity of the semiconductor package to the outer area of the substrate surface using the dam structure. In another embodiment, a substrate surface of a semiconductor package includes product forming areas to provide mounting spaces of semiconductor chips and staggered offset mesh block areas surrounding the product forming areas to act as dam structures to minimize mold bleeding from a mold cavity of the semiconductor package to outer areas of the substrate surface.

Growing community of inventors

Georgtown, Malaysia

Murugasan Manikam Achari