The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 22, 2013
Filed:
Aug. 10, 2010
Lai Nguk Chin, Penang, MY;
Foong Yue Ho, Penang, MY;
Wong Kwet Nam, Penang, MY;
Koo Eng Luon, Penang, MY;
Sally Foong, Milpitas, CA (US);
Kevin Guan, Richmond, CA (US);
Lai Nguk Chin, Penang, MY;
Foong Yue Ho, Penang, MY;
Wong Kwet Nam, Penang, MY;
Koo Eng Luon, Penang, MY;
Sally Foong, Milpitas, CA (US);
Kevin Guan, Richmond, CA (US);
Spansion LLC, Sunnyvale, CA (US);
Abstract
A method for die stacking is disclosed. In one embodiment a first die is formed overlying a substrate. A first wire is bonded to the first die and to a bond finger of the substrate, wherein the first wire is bonded to the bond finger with a first bond. A first stitch bump is formed overlying the first stitch bond, wherein the first stitch bump is formed from a molten ball of conductive material. A second die is formed overlying the first die. A second wire is bonded to the second die and to the first stitch bump, wherein the second wire is bonded to the first stitch bump with a second bond.