The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2014
Filed:
Jun. 29, 2010
Lai Nguk Chin, Penang, MY;
Foong Yue Ho, Penang, MY;
Wong Kwet Nam, Penang, MY;
Thor Lee Lee, Penang, MY;
Sally Foong, Milpitas, CA (US);
Kevin Guan, Richmond, CA (US);
Lai Nguk Chin, Penang, MY;
Foong Yue Ho, Penang, MY;
Wong Kwet Nam, Penang, MY;
Thor Lee Lee, Penang, MY;
Sally Foong, Milpitas, CA (US);
Kevin Guan, Richmond, CA (US);
Spansion LLC, Sunnyvale, CA (US);
Abstract
A system and method for a thin multi chip stack package with film on wire and copper wire. The package comprises a substrate and a first die overlying the substrate. Copper wires electrically connect the first die to the substrate. A film overlies the first die and a portion of the copper wires. In addition, the film adheres a second die to the first die. The film also electrically insulates the copper wires from the second die.