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For the Inventor, By the Inventor

Hsin-Chu, Taiwan

Ruey-Yun Shiue

USPTO Granted Patents = 12

Average Co-Inventor Count = 3.1

ph-index = 9

Forward Citations = 208(Granted Patents)


Location History:

  • Hsiu-Chu, TW (1999)
  • Hsin-Chu, TW (1997 - 2015)

Company Filing History:

goldMedal12 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 1997-2015

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12 patents (USPTO):
1. 9209048 - Two step molding grinding for packaging applications (2015-12-08),
2. 7759797 - Bonding pad structure to minimize IMD cracking (2010-07-20),
3. 7323784 - Top via pattern for bond pad structure (2008-01-29),
4. 7135395 - Bonding pad structure to minimize IMD cracking (2006-11-14),
5. 6875682 - Mesh pad structure to eliminate IMD crack on pad (2005-04-05),
6. 6451679 - Ion mixing between two-step titanium deposition process for titanium salicide CMOS technology (2002-09-17),
7. 6140693 - Method for making metal capacitors for deep submicrometer processes for (2000-10-31),
8. 5953601 - ESD implantation scheme for 0.35 .mu.m 3.3V 70A gate oxide process (1999-09-14),
9. 5946567 - Method for making metal capacitors for deep submicrometer processes for (1999-08-31),
10. 5923088 - Bond pad structure for the via plug process (1999-07-13),
11. 5781445 - Plasma damage monitor (1998-07-14),
12. 5700735 - Method of forming bond pad structure for the via plug process (1997-12-23),

Title: Innovations of Ruey-Yun Shiue

Introduction

Ruey-Yun Shiue is a prominent inventor based in Hsin-Chu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 12 patents. His work focuses on innovative methods and processes that enhance the efficiency and reliability of semiconductor packaging.

Latest Patents

Among his latest patents is a method for two-step molding grinding for packaging applications. This method includes mounting a die to a substrate, encapsulating it in a mold compound, and performing further processing to optimize the device. Another notable patent involves a bonding pad structure designed to minimize inter-metal dielectric (IMD) cracking. This method utilizes a partially processed semiconductor wafer and involves forming trenches filled with conducting material to enhance the durability of bonding pads.

Career Highlights

Ruey-Yun Shiue has established himself as a key figure in the semiconductor industry. He works at Taiwan Semiconductor Manufacturing Company Limited, where he continues to innovate and develop new technologies. His expertise in semiconductor packaging has led to advancements that benefit the entire industry.

Collaborations

Ruey-Yun has collaborated with several talented individuals, including Chung Chang Liu and Yuan-Lung Liu. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Ruey-Yun Shiue's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor. His innovative methods continue to shape the future of the industry.

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