The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 29, 2008
Filed:
Mar. 17, 2005
Ho-yin Yiu, Hsinchu, TW;
Fu-jier Fan, Hsinchu Hsien, TW;
Yu-jui Wu, Su-ao Township, TW;
Aaron Wang, Hsin Chu, TW;
Hsiang-wei Wang, Hsin-Chu, TW;
Huang-sheng Lin, Hsin Chu, TW;
Ming-hsien Chen, Hsin Chu, TW;
Ruey-yun Shiue, Hsin-Chu, TW;
Ho-Yin Yiu, Hsinchu, TW;
Fu-Jier Fan, Hsinchu Hsien, TW;
Yu-Jui Wu, Su-ao Township, TW;
Aaron Wang, Hsin Chu, TW;
Hsiang-Wei Wang, Hsin-Chu, TW;
Huang-Sheng Lin, Hsin Chu, TW;
Ming-Hsien Chen, Hsin Chu, TW;
Ruey-Yun Shiue, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-chu, TW;
Abstract
Top via pattern for a bond pad structure has at least one first via group and at least one second via group adjacent to each other. The first via group has at least two line vias extending in a first direction. The second via group has at least two line vias extending in a second direction different from said first direction. The line via of the first via group does not cross the line via of the second via group.