The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2015
Filed:
May. 13, 2014
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Wen-Chun Huang, Jhongli, TW;
Chien-Chen Li, Hsin-Chu, TW;
Kuo-Chio Liu, Hsin-Chu, TW;
Ruey-Yun Shiue, Hsin-Chu, TW;
Hsi-Kuei Cheng, Jhubei, TW;
Chih-Hsien Lin, Tai-Chung, TW;
Jing-Cheng Lin, Tung Zhen, TW;
Hsiang-Tai Lu, Zhubei, TW;
Tzi-Yi Shieh, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
Embodiments of the present disclosure include semiconductor packages and methods of forming the same. An embodiment is a method including mounting a die to a top surface of a substrate to form a device, encapsulating the die and top surface of the substrate in a mold compound, the mold compound having a first thickness over the die, and removing a portion, but not all, of the thickness of the mold compound over the die. The method further includes performing further processing on the device, and removing the remaining thickness of the mold compound over the die.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile