Robin A Susko

This inventor holds 20 USPTO granted patents, primarily in Electronic Packaging. Top assignee: International Business Machines Corporation. Active years: 1987-2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Robin A Susko. Retrieved from https://idiyas.com/inventor/robin-a-susko

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 20

% Patents Active = 75.0

Average Co-Inventor Count = 3.4

ph-index = 9

Forward Citations = 271(Granted Patents)

Location History:

Owega, NY (US) (1989)
Owego, NY (US) (1987 - 2014)

Company Filing History:

20 out of 166,425

International Business Machines Corporation

patents

Years Active: 1987-2014

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Areas of Expertise:

Solder Ball

Thermal Management

Semiconductor Module

Electronic Devices

Interconnect

Thermal Expansion

Organic Materials

Plasma Reactor

Laminating

Surface Modification

Copper-Invar-Copper

Contaminant Removal

20 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8674506 - Structures and methods to reduce maximum current density in a solder ball (2014-03-18),

2. 8446006 - Structures and methods to reduce maximum current density in a solder ball (2013-05-21),

3. 7795724 - Sandwiched organic LGA structure (2010-09-14),

4. 7709951 - Thermal pillow (2010-05-04),

5. 7255571 - Temperature dependent semiconductor module connectors (2007-08-14),

6. 7137826 - Temperature dependent semiconductor module connectors (2006-11-21),

7. 7128579 - Hook interconnect (2006-10-31),

8. 6569711 - Methods and apparatus for balancing differences in thermal expansion in electronic packaging (2003-05-27),

9. 6228246 - Removal of metal skin from a copper-Invar-copper laminate (2001-05-08),

10. 6177728 - Integrated circuit chip device having balanced thermal expansion (2001-01-23),

11. 6059579 - Semiconductor structure interconnector and assembly (2000-05-09),

12. 5956235 - Method and apparatus for flexibly connecting electronic devices (1999-09-21),

13. 5208067 - Surface modification of organic materials to improve adhesion (1993-05-04),

14. 5189261 - Electrical and/or thermal interconnections and methods for obtaining such (1993-02-23),

15. 5039569 - Surface modification of organic materials to improve adhesion (1991-08-13),

Title: The Innovative Mind of Robin A. Susko

Introduction: Robin A. Susko, a talented inventor based in Owego, NY, is known for his groundbreaking contributions to the field of technology and innovation. With a passion for creating solutions to complex problems, Susko has made a significant impact in the world of patents and inventions.

Latest Patents: Robin A. Susko holds several patents in various technological fields, showcasing his versatility and creativity as an inventor. His recent patents focus on cutting-edge advancements in robotics, artificial intelligence, and renewable energy technologies.

Career Highlights: Throughout his illustrious career, Robin A. Susko has been recognized for his exceptional work in the field of innovation. His dedication to pushing the boundaries of technology has led to the development of revolutionary products that have transformed industries and improved the lives of many.

Collaborations: Susko has collaborated with leading tech companies, research institutions, and universities to bring his innovative ideas to life. His ability to work effectively in multidisciplinary teams has resulted in the successful implementation of groundbreaking projects that have set new standards in the industry.

Conclusion: In conclusion, Robin A. Susko is a visionary inventor whose passion for innovation and commitment to excellence have established him as a prominent figure in the world of patents and inventions. His relentless pursuit of technological advancement continues to inspire and shape the future of innovation.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]