The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2013
Filed:
Dec. 17, 2009
Raschid J. Bezama, Mahopac, NY (US);
Timothy H. Daubenspeck, Colchester, VT (US);
Gary Lafontant, Elmont, NY (US);
Ian D. Melville, Highland, NY (US);
Ekta Misra, Fishkill, NY (US);
George J. Scott, Wappingers Falls, NY (US);
Krystyna W. Semkow, Poughquag, NY (US);
Timothy D. Sullivan, Underhill, VT (US);
Robin A. Susko, Owego, NY (US);
Thomas A. Wassick, LaGrangeville, NY (US);
Xiaojin Wei, Poughkeepsie, NY (US);
Steven L. Wright, Cortlandt Manor, NY (US);
Raschid J. Bezama, Mahopac, NY (US);
Timothy H. Daubenspeck, Colchester, VT (US);
Gary LaFontant, Elmont, NY (US);
Ian D. Melville, Highland, NY (US);
Ekta Misra, Fishkill, NY (US);
George J. Scott, Wappingers Falls, NY (US);
Krystyna W. Semkow, Poughquag, NY (US);
Timothy D. Sullivan, Underhill, VT (US);
Robin A. Susko, Owego, NY (US);
Thomas A. Wassick, LaGrangeville, NY (US);
Xiaojin Wei, Poughkeepsie, NY (US);
Steven L. Wright, Cortlandt Manor, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Structures and methods to reduce maximum current density in a solder ball are disclosed. A method includes forming a contact pad in a last wiring level and forming a plurality of wires of the contact pad extending from side edges of the contact pad to respective ones of a plurality of vias. Each one of the plurality of wires has substantially the same electrical resistance.