The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2006
Filed:
Aug. 19, 2005
William L. Brodsky, Binghamton, NY (US);
James A. Busby, New Paltz, NY (US);
Bruce J. Chamberlin, Vestal, NY (US);
Mitchell G. Ferrill, Little Meadows, PA (US);
Robin A. Susko, Owego, NY (US);
James R. Wilcox, Vestal, NY (US);
William L. Brodsky, Binghamton, NY (US);
James A. Busby, New Paltz, NY (US);
Bruce J. Chamberlin, Vestal, NY (US);
Mitchell G. Ferrill, Little Meadows, PA (US);
Robin A. Susko, Owego, NY (US);
James R. Wilcox, Vestal, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Disclosed is a semiconductor package structure that incorporates the use of conductive pins to electrically and mechanically connect a semiconductor module and a substrate (e.g., printed wiring board). Specifically, one or both ends of the pins are hooked and are adapted to allow a press-fit connection with the walls of the plated through holes of either one or both of the semiconductor module and the substrate. The hook-shaped ends of the pins may have one or more hooks to establish the connection. Additionally, the pins may be formed of a temperature induced shape change material that bends to allow engaging and/or disengaging of the hook-shaped ends from the walls of the plated through holes.