The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 1993
Filed:
Oct. 09, 1990
Applicant:
Inventors:
Lawrence C Alexander, Whitney Point, NY (US);
Bernd K Appelt, Apalachin, NY (US);
David K Balkin, Mishawaka, IN (US);
James J Hansen, Endicott, NY (US);
Joseph Hromek, Endwell, NY (US);
Ronald A Kaschak, Vestal, NY (US);
John M Lauffer, Waverly, NY (US);
Irving Memis, Vestal, NY (US);
Magan S Patel, Endicott, NY (US);
Andrew M Seman, Kirkwood, NY (US);
Robin A Susko, Owego, NY (US);
Assignee:
IBM Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
174263 ; 29846 ; 428901 ;
Abstract
Circuit boards or cards containing metallic layers on opposite major surfaces of a dielectric substrate whereby electrical and/or thermal interconnection between the metallic layers is provided in vias that extend through one of the metallic layers, and the dielectric substrate and into the other metallic layer.