Company Filing History:
Years Active: 1976-1999
Title: Joseph Hromek: Innovator in Device Testing and Interconnections
Introduction
Joseph Hromek is a notable inventor based in Endwell, NY (US), recognized for his contributions to the field of device testing and electrical interconnections. With a total of three patents to his name, Hromek has made significant advancements that enhance the reliability and efficiency of electronic devices.
Latest Patents
Hromek's latest patents include an innovative apparatus and method for burn-in and testing of devices with solder. This invention focuses on forming temporary connections to flip-chip style chips, which have solder bumps or preforms. The method aims to avoid distortion of these solder components while ensuring that the testing and burn-in processes do not damage the testing equipment. The use of a resilient bucketed interposer with specially designed recesses allows for effective connections without compromising the integrity of the solder bumps. Additionally, Hromek has developed methods for electrical and thermal interconnections that utilize vias extending through metallic layers on circuit boards, enhancing the performance of electronic devices.
Career Highlights
Hromek is currently employed at International Business Machines Corporation (IBM), where he continues to innovate and contribute to the field of electronics. His work has been instrumental in identifying 'known good' chips or dies before package completion, thereby reducing the need for rework in modular circuit packages.
Collaborations
Throughout his career, Hromek has collaborated with esteemed colleagues such as Kishor V Desai and Octavio I Chirino, further enriching his contributions to the industry.
Conclusion
Joseph Hromek's work exemplifies the spirit of innovation in the electronics field, particularly in device testing and interconnections. His patents reflect a commitment to improving technology and ensuring the reliability of electronic devices.