Company Filing History:
Years Active: 1993
Title: Magan S Patel: Innovator in Electrical and Thermal Interconnections
Introduction
Magan S Patel is a notable inventor based in Endicott, NY (US). She has made significant contributions to the field of electrical and thermal interconnections, showcasing her expertise through her innovative patent.
Latest Patents
Magan holds a patent for "Electrical and/or thermal interconnections and methods for obtaining such." This invention pertains to circuit boards or cards that contain metallic layers on opposite major surfaces of a dielectric substrate. The patent describes how electrical and/or thermal interconnection between the metallic layers is achieved through vias that extend through one of the metallic layers, the dielectric substrate, and into the other metallic layer. She has 1 patent to her name.
Career Highlights
Magan is currently employed at International Business Machines Corporation, commonly known as IBM. Her work at IBM has allowed her to be at the forefront of technological advancements in her field.
Collaborations
Throughout her career, Magan has collaborated with esteemed colleagues, including Lawrence C Alexander and Bernd Karl Appelt. These collaborations have further enriched her work and contributed to her innovative projects.
Conclusion
Magan S Patel is a pioneering inventor whose work in electrical and thermal interconnections has made a significant impact in the technology sector. Her contributions continue to influence advancements in circuit board design and functionality.