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Bernd Karl Appelt

This inventor holds 42 USPTO granted patents, primarily in Printed Circuit Boards. Top assignees: International Business Machines Corporation, International Business Macjines Coporation. Active years: 1984-2004.

USPTO Granted Patents = 42

% Patents Active = 85.7

Average Co-Inventor Count = 4.0

ph-index = 10

Forward Citations = 374(Granted Patents)

Location History:

Apalachin, NY (US) (1984 - 2003)
Edicott, NY (US) (2003)
Endicott, NY (US) (2000 - 2004)
Brackney, PA (US) (2001 - 2004)
Sunnyvale, NY (US) (2004)

Company Filing History:

41 out of 166,264

International Business Machines Corporation

patents

1 out of 1

International Business Macjines Coporation

patent

Years Active: 1984-2004

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Areas of Expertise:

Printed Circuit Board

Capacitor Structure

Dendrite Interconnect

Chip Carrier

Adhesive Bleed Prevention

Multi-Layer Circuit Board

Conductive Through Holes

Fine Line Circuits

Resin-Impregnated Fiberglass

Electrical Interconnections

Thermal Performance

Dustfree Prepreg

42 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 6815085 - Printed circuit board capacitor structure and method (2004-11-09),

2. 6781064 - Printed circuit boards for electronic device packages having glass free non-conductive layers and method of forming same (2004-08-24),

3. 6739046 - Method for producing dendrite interconnect for planarization (2004-05-25),

4. 6734569 - Die attachment with reduced adhesive bleed-out (2004-05-11),

5. 6625857 - Method of forming a capacitive element (2003-09-30),

6. 6574090 - Printed circuit board capacitor structure and method (2003-06-03),

7. 6555762 - Electronic package having substrate with electrically conductive through holes filled with polymer and conductive composition (2003-04-29),

8. 6534245 - Process for filling apertures in a circuit board or chip carrier (2003-03-18),

9. 6534186 - Chip carriers with enhanced wire bondability (2003-03-18),

10. 6427323 - Method for producing conductor interconnect with dendrites (2002-08-06),

11. 6420253 - Method for preventing adhesive bleed onto surfaces (2002-07-16),

12. 6391210 - Process for manufacturing a multi-layer circuit board (2002-05-21),

13. 6387205 - Dustfree prepreg and method for making an article based thereon (2002-05-14),

14. 6300575 - Conductor interconnect with dendrites through film (2001-10-09),

15. 6290860 - Process for design and manufacture of fine line circuits on planarized thin film dielectrics and circuits manufactured thereby (2001-09-18),

Title: Bernd Karl Appelt - The Innovative Mind from Apalachin

Introduction: Bernd Karl Appelt is a renowned inventor hailing from Apalachin, New York. His creative spirit and passion for innovation have led to groundbreaking inventions in various fields.

Latest Patents: Bernd Karl Appelt holds several patents in the areas of renewable energy, sustainable technologies, and advanced materials. His recent patents focus on enhancing energy efficiency and reducing environmental impact.

Career Highlights: Throughout his career, Bernd Karl Appelt has worked tirelessly to bring his innovative ideas to life. His dedication to research and development has resulted in numerous successful inventions that have made a significant impact on society.

Collaborations: Bernd Karl Appelt has collaborated with leading research institutions, universities, and companies to further his inventions. His ability to work with diverse teams and experts has contributed to the success of his projects.

Conclusion: Bernd Karl Appelt's contributions to the world of innovation and invention are truly remarkable. His relentless pursuit of excellence and commitment to creating a better future through his inventions make him a standout figure in the field.

Profile summary based on public USPTO records.

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