IDiyas

For the Inventor, By the Inventor

Kirkwood, NY, United States of America

Andrew Michael Seman

USPTO Granted Patents = 16

Average Co-Inventor Count = 4.8

ph-index = 5

Forward Citations = 258(Granted Patents)


Company Filing History:

goldMedal16 out of 164,108 
 
International Business Machines Corporation
 patents

Years Active: 1993-2009

Loading Chart...
16 patents (USPTO):
1. 7596862 - Method of making a circuitized substrate (2009-10-06),
2. 7325299 - Method of making a circuitized substrate (2008-02-05),
3. 7240430 - Manufacturing methods for printed circuit boards (2007-07-10),
4. 7185428 - Method of making a circuitized substrate (2007-03-06),
5. 7063756 - Enhanced design and process for a conductive adhesive (2006-06-20),
6. 6931722 - Method of fabricating printed circuit board with mixed metallurgy pads (2005-08-23),
7. 6902869 - Manufacturing methods for printed circuit boards (2005-06-07),
8. 6822332 - Fine line circuitization (2004-11-23),
9. 6684497 - Manufacturing methods for printed circuit boards (2004-02-03),
10. 6586683 - Printed circuit board with mixed metallurgy pads and method of fabrication (2003-07-01),
11. 6534724 - Enhanced design and process for a conductive adhesive (2003-03-18),
12. 6429390 - Structure and method for forming the same of a printed wiring board having built-in inspection aids (2002-08-06),
13. 6222136 - Printed circuit board with continuous connective bumps (2001-04-24),
14. 6178630 - Conductive bonding design and method for aluminum backed circuits (2001-01-30),
15. 5920037 - Conductive bonding design for metal backed circuits (1999-07-06),

Title: The Innovative Contributions of Andrew Michael Seman

Introduction

Andrew Michael Seman is a notable inventor based in Kirkwood, NY (US). He has made significant contributions to the field of circuitized substrates, holding a total of 16 patents. His work has been instrumental in advancing technology in this area.

Latest Patents

One of Seman's latest patents is a method of making a circuitized substrate. This method involves creating a substrate with a substantially planar upper surface and a conductive layer positioned on it. The conductive layer features at least one side wall that defines an opening, with an end portion forming an acute angle with the upper surface of the substrate. Another recent patent also focuses on a method of making a circuitized substrate, detailing the formation of a conductive layer in direct mechanical contact with the substrate's upper surface. This process includes removing portions of the conductive layer and forming a layer of patternable material, which is crucial for the development of advanced circuitized substrates.

Career Highlights

Andrew Michael Seman is currently associated with International Business Machines Corporation (IBM). His work at IBM has allowed him to explore innovative solutions in the realm of circuit design and manufacturing.

Collaborations

Seman has collaborated with notable coworkers such as Donald Seton Farquhar and Michael Joseph Klodowski. Their combined expertise has contributed to the successful development of various technologies.

Conclusion

Andrew Michael Seman's contributions to the field of circuitized substrates are noteworthy. His innovative methods and patents continue to influence advancements in technology.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…