The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2004
Filed:
Feb. 20, 2001
Bernd Karl-Heinz Appelt, Apalachin, NY (US);
James Russell Bupp, Endwell, NY (US);
Donald Seton Farquhar, Endicott, NY (US);
Ross William Keesler, Endicott, NY (US);
Michael Joseph Klodowski, Endicott, NY (US);
Andrew Michael Seman, Kirkwood, NY (US);
Gary Lee Schild, Endicott, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method of forming a printed circuit board comprising a plurality of conductive bumps with substantially coplanar upper surfaces. The method comprises the steps of applying a metal layer onto a dielectric substrate; applying a first photoresist onto said substrate and exposing and developing said first photoresist to define a pattern of conductive bumps; etching the metal layer exposed by said development to form said plurality of conductive bumps; removing said first photoresist; applying a second photoresist onto the metal layer; exposing and developing said second photoresist to define a pattern of conductive bumps and circuit lines; etching the metal layer exposed by said development to form a pattern of circuit lines in said metal layer; and removing said second photoresist. The present invention is also provides a method for preparing a reinforced panel.