Endicott, NY, United States of America

Michael Joseph Klodowski


Average Co-Inventor Count = 4.5

ph-index = 10

Forward Citations = 482(Granted Patents)


Company Filing History:


Years Active: 1998-2008

where 'Filed Patents' based on already Granted Patents

21 patents (USPTO):

Title: **Michael Joseph Klodowski: Innovator in Electronic Packaging and Circuit Board Manufacturing**

Introduction

Michael Joseph Klodowski, based in Endicott, NY, is a prominent inventor known for his significant contributions to electronic packaging and circuit board manufacturing. With a total of 21 patents to his name, Klodowski has demonstrated a commitment to advancing technology in these fields.

Latest Patents

Among Klodowski's latest innovations is the patent for an "Electronic package with optimized lamination process." This invention describes a method of forming an electronic package that includes a thermally conductive layer, which has first and second opposing surfaces. The process involves laminating dielectric layers under specific temperature conditions that optimize their ductility and performance.

Additionally, he has developed a patent focused on "Manufacturing methods for printed circuit boards." This method outlines the formation of solid conductive bumps for interconnecting two conductive layers on a circuit board, emphasizing the steps of applying metal layers and photoresists to create efficient and effective circuit patterns.

Career Highlights

Michael Joseph Klodowski is associated with the International Business Machines Corporation (IBM), where he has made impactful advancements in technology. His work has been recognized not only for its technical proficiency but also for its potential applications in various electronic and manufacturing contexts. The innovative solutions he has developed contribute to IBM’s reputation as a leader in technological innovation.

Collaborations

Throughout his career, Klodowski has collaborated with esteemed colleagues, including Donald Seton Farquhar and Andrew Michael Seman. These partnerships have allowed for a fusion of ideas that enhances the creative process and leads to groundbreaking developments in the industry.

Conclusion

Michael Joseph Klodowski exemplifies the spirit of innovation through his substantial contributions to the fields of electronic packaging and circuit board manufacturing. His patents are a testament to his dedication to enhancing technology and improving manufacturing processes. As he continues to develop new solutions, Klodowski remains a key figure in pushing the boundaries of engineering and design.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…