The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 12, 2008
Filed:
Jun. 08, 2005
Donald S. Farquhar, Endicott, NY (US);
James D. Herard, Vestal, NY (US);
Michael J. Klodowski, Endicott, NY (US);
David Questad, Vestal, NY (US);
Der-jin Woan, Endicott, NY (US);
Donald S. Farquhar, Endicott, NY (US);
James D. Herard, Vestal, NY (US);
Michael J. Klodowski, Endicott, NY (US);
David Questad, Vestal, NY (US);
Der-jin Woan, Endicott, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An electronic package and method of formation. A thermally conductive layer having first and second opposing surfaces is provided. A first dielectric layer is laminated under pressurization to the first opposing surface of the thermally conductive layer, at a temperature between a minimum temperature Tand a maximum temperature T. Tconstrains the ductility of the first dielectric layer to be at least Dfollowing the laminating. Tdepends on Dand on a first dielectric material comprised by the first dielectric layer. A second dielectric layer is laminated under pressurization to the second opposing surface of the thermally conductive layer, at a temperature between a minimum temperature Tand a maximum temperature T. Tconstrains the ductility of the second dielectric layer to be at least Dfollowing the laminating. Tdepends on Dand on a second dielectric material comprised by the second dielectric layer.