Endicott, NY, United States of America

Der-jin Woan


Average Co-Inventor Count = 5.5

ph-index = 3

Forward Citations = 26(Granted Patents)


Location History:

  • Vestal, NY (US) (2001 - 2002)
  • Endicott, NY (US) (2006 - 2008)

Company Filing History:


Years Active: 2001-2008

Loading Chart...
4 patents (USPTO):

Title: The Innovations of Der-jin Woan

Introduction

Der-jin Woan is a notable inventor based in Endicott, NY (US). She has made significant contributions to the field of electronics, particularly in the development of advanced electronic packaging technologies. With a total of 4 patents to her name, her work has had a substantial impact on the industry.

Latest Patents

One of her latest patents is titled "Electronic package with optimized lamination process." This invention involves an electronic package and a method of formation that includes a thermally conductive layer with first and second opposing surfaces. A first dielectric layer is laminated under pressurization to the first opposing surface of the thermally conductive layer, at a temperature that constrains the ductility of the first dielectric layer. Similarly, a second dielectric layer is laminated under pressurization to the second opposing surface of the thermally conductive layer, ensuring optimal performance and reliability.

Career Highlights

Der-jin Woan is currently employed at the International Business Machines Corporation (IBM). Her work at IBM has allowed her to explore innovative solutions in electronic packaging, contributing to the advancement of technology in this field.

Collaborations

Throughout her career, Der-jin has collaborated with esteemed colleagues, including James D. Herard and Norman A. Card. These collaborations have fostered a creative environment that has led to groundbreaking innovations.

Conclusion

Der-jin Woan's contributions to electronic packaging and her innovative patents highlight her role as a leading inventor in her field. Her work continues to influence the development of advanced technologies in electronics.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…