The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 20, 2006
Filed:
Feb. 04, 2003
Applicants:
Donald Seton Farquhar, Endicott, NY (US);
Gerald Paul Kohut, Whitney Point, NY (US);
Andrew Michael Seman, Kirkwood, NY (US);
Michael Joseph Klodowski, Endicott, NY (US);
Inventors:
Donald Seton Farquhar, Endicott, NY (US);
Gerald Paul Kohut, Whitney Point, NY (US);
Andrew Michael Seman, Kirkwood, NY (US);
Michael Joseph Klodowski, Endicott, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/04 (2006.01); H05K 1/02 (2006.01); H01L 21/50 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
The present invention provides a new device and method for enhancing the electrical properties of the thick metal backer/electrically conductive thermoset adhesive/printed circuit board or card assembly. The enhanced electrical properties are obtained by providing a thin bondline of conductive adhesive that is essentially void free.