The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 2010
Filed:
Aug. 30, 2007
William L. Brodsky, Binghamton, VT (US);
James A. Busby, New Paltz, NY (US);
Bruce J. Chamberlin, Vestal, NY (US);
Mitchell G. Ferrill, Little Meadows, PA (US);
David L. Questad, Hopewell Junction, NY (US);
Robin A. Susko, Owego, NY (US);
William L. Brodsky, Binghamton, VT (US);
James A. Busby, New Paltz, NY (US);
Bruce J. Chamberlin, Vestal, NY (US);
Mitchell G. Ferrill, Little Meadows, PA (US);
David L. Questad, Hopewell Junction, NY (US);
Robin A. Susko, Owego, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An LGA structure is provided having at least one semiconductor device over a substrate and a mechanical load apparatus over the semiconductor device. The structure includes a load-distributing material between the mechanical load apparatus and the substrate. Specifically, the load-distributing material is proximate a first side of the semiconductor device and a second side of the semiconductor device opposite the first side of the semiconductor device. Furthermore, the load-distributing material completely surrounds the semiconductor device and contacts the mechanical load apparatus, the substrate, and the semiconductor device. The load-distributing material can be thermally conductive and comprises an elastomer and/or a liquid. The load-distributing material comprises a LGA interposer adapted to connect the substrate to a PCB below the substrate and/or a second substrate. Moreover, the load-distributing material comprises compressible material layers and rigid material layers. The load-distributing material comprises a rigid material incased in a compressible material.